Science & Tech · Gadgets & EVs · 1 hr ago

Apple redesigned the iPhone Duo’s cooling system to manage heat in its thin design

Apple redesigned the iPhone Duo’s cooling system to manage heat in its thin design

Apple redesigned parts of the iPhone Duo to manage heat in its thin design.

The phone uses Apple’s A20 Pro chip, with memory placed beside the processor instead of stacked on top of it.

Apple says this packaging gives heat a more direct path away from the chip while keeping memory communications fast.

A redesigned vapor chamber spreads heat and has three times the surface area of the previous version.

The phone also uses a material between the chip and vapor chamber, plus a heat-conducting layer behind the display.

These changes are meant to help the device handle heat as it runs.

The information provided does not say what happens next.

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