Business · Markets · 1 day ago

DayOne explores $500 million bond after filing for US IPO

DayOne explores $500 million bond after filing for US IPO

DayOne, a data center operator based in Singapore, is exploring a bond worth about US$500 million.

The company filed for an initial public offering in the United States this week.

An initial public offering is when a company offers shares to public investors.

DayOne has also considered raising about US$5 billion.

The bond exploration and the possible larger fundraising are separate financing plans.

The information available does not say whether DayOne will proceed with the bond or the larger fundraising.

Sources

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