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Vaishnaw Explains India’s Journey From Sand to Semiconductor Chips

Vaishnaw Explains India’s Journey From Sand to Semiconductor Chips
How semiconductor chips are made: Ashwini Vaishnaw explains journey from sand to chip · businesstoday.in

Computer chips start with silica-rich sand that is turned into a solid silicon cylinder called an ingot.

The ingot is sliced into very thin discs called wafers.

Tiny circuit patterns are then placed on the wafers with extraordinary precision.

Many layers are built, like floors in a very small building.

The wafer is cut into individual chips.

Each chip is assembled, tested, marked, and packaged before it can be used.

India is working to make more parts of this process inside the country.

The government says it wants to develop factories, suppliers, designers, and student talent for the long term.

Key facts

Starting material
Silica-rich sand
Manufacturing sequence
Sand, silicon ingot, bare wafer, fabricated wafer, chip, and modules
Wafer circuitry
Approximately 40 to 50 layers
Chip packaging process
Assembly, testing, marking, and packaging, known as ATMP
Approved plants
12 plants approved under Semiconductor Mission 1.0
Plants manufacturing
Three approved plants have started manufacturing
Next phase
Semicon 2.0
Design ecosystem
India’s semiconductor design ecosystem is described as very nascent

Quotes

Ashwini Vaishnaw

India’s IT minister and leader of the country’s semiconductor mission

“That is the level of precision which is required to be done while fabricating the chips.”
businesstoday.in
“We didn't say just set up a fab. No. We need to develop the entire ecosystem.”
businesstoday.in

Sources

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