1 week ago

Xiaomi Expands Chipmaking With Xring O3 and TSMC

Xiaomi Expands Chipmaking With Xring O3 and TSMC
Xiaomi launches new Xring chip, partners with TSMC for production · indianexpress.com

Xiaomi has announced a new smartphone chip called the Xring O3.

It is designed to handle computing, graphics, artificial intelligence and camera tasks in one part.

TSMC is expected to make it using a very small 3-nanometre process.

Xiaomi may use the chip in a new high-end folding phone.

The company hopes making its own chips will give it more control and reduce its dependence on Qualcomm and MediaTek.

Xiaomi says more than 1 million devices using its older Xring O1 have shipped.

However, sources say about 150,000 smartphones using the O1 were sold, which is a smaller number because Xiaomi's figure includes tablets and watches.

Xiaomi also announced chips for its MiMo AI model and autonomous-driving systems.

Key facts

New processor
Xring O3
Manufacturing
TSMC is expected to produce the O3 using 3-nanometre technology.
Potential device
Xiaomi’s upcoming flagship folding phone
Reported foldable-phone target
200,000 to 300,000 units
Xring O1 shipments
Xiaomi said devices powered by the O1, including smartphones, tablets and watches, surpassed 1 million cumulative shipments.
Alternative O1 estimate
Sources estimated that about 150,000 smartphones using the O1 had been sold since May 2025.
Additional chips
The Xring O100 is a 6-nanometre neural-processing unit for Xiaomi’s MiMo model, while the Xring D100 is a 3-nanometre autonomous-driving chip.
Chip deployment
Xiaomi says the O3 has entered mass production; the O100 and D100 are slated for deployment next year.

Sources

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