1 week ago
Xiaomi Unveils XRING O3 Ahead of Xiaomi 18 Fold Launch
Xiaomi has made a new computer chip called the XRING O3.
A chip is the part of a phone that helps it run apps and games.
Xiaomi says this chip is very fast and uses less power than its older chip.
It has 10 processing cores and a 16-core graphics processor.
The chip scored highly in early performance tests.
Xiaomi wants to rely less on outside chip companies such as Qualcomm.
The XRING O3 will first appear in a foldable phone called the Xiaomi 18 Fold.
That phone is planned for September 2026, with a limited first production run.
Xiaomi introduced the XRING O3, its latest flagship mobile processor.
The chip uses TSMC’s 3nm process and contains 24 billion transistors.
Xiaomi says the 10-core processor reaches 4.35 GHz and improves multi-core performance by about 60 percent.
The XRING O3 will debut in the Xiaomi 18 Fold in September 2026.
Initial Xiaomi 18 Fold production is expected to reach 200,000 to 300,000 units.
- Who
- Xiaomi developed and introduced the XRING O3 processor.
- What
- The XRING O3 is a new flagship chip that will debut in the Xiaomi 18 Fold.
- Where
- The articles do not specify a launch location.
- When
- The Xiaomi 18 Fold is scheduled to launch in September 2026.
- Why
- Xiaomi aims to improve performance, control its hardware roadmap and supply chain, and reduce reliance on third-party chipmakers.
Key facts
- Processor
- XRING O3
- Manufacturing process
- TSMC’s 3nm process
- Transistors
- 24 billion
- CPU and GPU
- 10-core CPU and 16-core GPU
- Peak clock speed
- 4.35 GHz
- Reported benchmarks
- AnTuTu: 5,228,014; Geekbench multi-core: 15,221
- Launch device and timing
- Xiaomi 18 Fold, scheduled for September 2026
- Expected initial production
- 200,000 to 300,000 units
