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India’s semiconductor strategy must move beyond chip packaging

India’s semiconductor strategy must move beyond chip packaging
​​​​​​​India’s semiconductor strategy needs to move beyond chip packaging, says Rajeev Chandrasekhar · businesstoday.in

Rajeev Chandrasekhar says India has made progress in building semiconductor factories.

However, he says many of the approved facilities mainly package and test chips.

Packaging is useful, but he believes it usually earns less than designing or manufacturing advanced chips.

He says artificial intelligence is changing what kinds of chips the world needs.

India may have an opportunity to build chips that run trained AI systems, called inference chips.

Chandrasekhar says India has 1.25 lakh chip-design engineers who could help with this work.

He also wants India to invest more in research, chip designs and advanced manufacturing.

His proposals include a research institute and a ₹1,000-crore fund.

He believes success should be measured by technological capability, not only by the number of factories approved.

Key facts

Approved units
12 semiconductor manufacturing units
Committed investment
₹1.64 lakh crore
Facilities in production
Five
India Semiconductor Mission 2.0
Another ₹1.275 lakh crore in investment, according to Chandrasekhar
Conventional facilities
Nine of the 12 approved units are conventional ATMP/OSAT facilities
Chip-design workforce
1.25 lakh chip-design engineers
Proposed fund
₹1,000 crore Chip Design Commercialisation Fund

Quotes

Rajeev Chandrasekhar

Former Indian minister and semiconductor policy advocate

“Nine of those 12 approved units are conventional ATMP/OSAT facilities — wire-bond assembly, testing, marking, and packaging”
businesstoday.in
“Semiconductors are not experiencing supply-chain diversification. They are experiencing an architectural revolution”
businesstoday.in

Sources

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