Business · Companies · 19 hrs ago
Sumitomo Bakelite to expand chip packaging materials output in China and Singapore
Sumitomo Bakelite, a Japanese semiconductor materials company, plans to expand production in Suzhou, China, and Singapore.
It will add lines to make mould underfill materials and compression-moulding granules, used in advanced chip packaging.
Demand for more sophisticated semiconductors is rising as artificial intelligence grows.
The company expects the expansion to roughly double its current capacity for mould underfill materials and triple capacity for the granules.
It did not disclose how much it will invest.
Production at the Singapore facility is expected to start at the end of fiscal 2028, while the Suzhou lines are scheduled to begin in fiscal 2030.
The plans add to a recent expansion of the company’s Chinese operations.
Sumitomo Bakelite plans to expand production of advanced chip packaging materials at facilities in Suzhou, China, and Singapore.
The company will add lines for mould underfill materials and compression-moulding granules.
The expansion is expected to roughly double mould underfill capacity and triple compression-moulding granules capacity.
Production is scheduled to start in Singapore at the end of fiscal 2028 and in Suzhou in fiscal 2030.
The company did not disclose the investment amount.
- Who
- Sumitomo Bakelite, a Japanese semiconductor materials company.
- What
- It plans to add production lines for mould underfill materials and compression-moulding granules.
- When
- Singapore operations are expected to begin at the end of fiscal 2028; Suzhou production is scheduled to begin in fiscal 2030.
- Where
- The company’s facilities in Suzhou, Jiangsu province, China, and Singapore.
- Why
- Demand for more sophisticated semiconductors is rising as artificial intelligence expands.
This story does not have two clearly opposing sides.
No direct quotes in the coverage so far.
Production from the new Singapore lines is expected to begin at the end of the fiscal year.
Production from the new Suzhou lines is scheduled to begin.
- Company
- Sumitomo Bakelite
- Locations
- Suzhou, Jiangsu province, China, and Singapore
- Mould underfill capacity
- Expected to roughly double current levels
- Compression-moulding granules capacity
- Expected to triple current levels
- Singapore start
- End of fiscal 2028
- Suzhou start
- Fiscal 2030
Sources
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