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America Lags in Memory Chips as Tariffs Threaten Progress
America does not currently make enough advanced memory chips.
Micron makes some of these chips in the United States.
However, the chips must still be sent to Asia for a final packaging step.
This step turns them into high-bandwidth memory, also called HBM.
HBM is important for training and using artificial-intelligence systems.
Micron wants to perform this packaging in the United States.
The company plans to do so after finishing a second plant in Idaho.
That plant is expected to be completed in late 2028, while tariffs could make the situation more difficult.
Micron still sends U.S.-made memory chips to Asia for final-step packaging.
The packaging process is needed to create high-bandwidth memory, or HBM.
HBM is used for artificial-intelligence training and usage.
Micron plans to add HBM packaging capabilities in the United States.
That capability is not expected until after Micron completes its second Idaho plant in late 2028.
- Who
- Micron and the United States memory-chip industry.
- What
- Micron’s U.S.-produced memory chips still require final-step packaging in Asia to become HBM.
- Where
- Memory chips are produced in the United States, then sent to Asia for packaging; the planned additional plant is in Idaho.
- When
- Micron expects to bring HBM packaging to the United States after completing its second Idaho plant in late 2028.
- Why
- HBM is needed for artificial-intelligence training and usage, but the United States currently lacks the required final-step packaging capability.
Key facts
- Company
- Micron
- Product
- High-bandwidth memory (HBM)
- Current production arrangement
- Micron sends U.S.-produced chips to Asia for final-step packaging.
- HBM use
- Artificial-intelligence training and usage
- Planned U.S. capability
- Micron plans to bring HBM packaging to the United States.
- Planned timing
- After completion of Micron’s second Idaho plant in late 2028
- Concern
- Tariffs threaten to make the memory-chip situation harder.
Sources
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