Business · Companies · 15 hrs ago

Samsung begins construction of $6 billion chip packaging plant in Asan

Samsung begins construction of $6 billion chip packaging plant in Asan

South Korean President Lee Jae Myung attended the start of a major investment project in Asan, in South Chungcheong Province, on November 12.

Samsung is building a 6 trillion won advanced chip-packaging plant at its Onyang campus, with a further 40 trillion won in advanced equipment investment planned in stages.

The site is intended to become a key hub for packaging high-bandwidth memory chips, used in advanced computing.

Other projects planned in the central Chungcheong region include memory and packaging facilities in Cheongju, an AI data center in Dangjin and a drug-production site in Osong.

Lee said the government would help provide permits, electricity and water so investment plans in Chungcheong, Honam and Yeongnam can proceed.

He said local residents should share in the gains, through opportunities for local businesses and jobs that allow young people to stay in the region.

The other regional projects are preparing for construction, while central and local governments have pledged to support their progress.

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What people are saying

Lee Jae-myungSouth Korean president
The fruits of these huge investments must be shared by local residents.
via Yonhap
I will focus all policy capabilities on ensuring that megaprojects do not stop at expanding companies’ production facilities to the regions, but are completed as ‘growth for all’ and ‘genuine balanced national development’ that tangibly change the lives of local communities and the people.
via Yonhap
Lee Jae-yongSamsung chairman
This place will transform into an advanced HBM hub, the heart of AI semiconductors.
via Donga Ilbo