Archive · 31 Jul 2026
Modi to Lay Stone for First ISM‑Approved OSAT in Visakhapatnam
Prime Minister Narendra Modi will lay the first stone for a new factory in Visakhapatnam that will make special chips for computers and phones.
The factory is built by a company called Advanced System In Package Technologies with help from a South Korean partner, APACT Co.
It will be the first of its kind in South India and can make 96 million chips each year.
The project will spend about 2,387.81 crore rupees and will create more than 1,000 jobs that need special skills and 1,600 jobs that don’t.
The chips will help computers that use artificial intelligence, big data centers, and fast internet, and India can also sell them to other countries.
Prime Minister Narendra Modi will lay the foundation stone for a new semiconductor packaging unit in Visakhapatnam.
The facility, built by Advanced System In Package Technologies with South Korean partner APACT Co, will be the first ISM‑approved OSAT in South India.
The two‑phase project will invest 2,387.81 crore rupees and produce 96 million chips per year.
It is expected to create over 1,000 direct and 1,600 indirect jobs in the region.
The plant will target AI, high‑performance computing, data centres and high‑speed communication, serving both domestic and export markets.
- Who
- Prime Minister Narendra Modi, Advanced System In Package Technologies, APACT Co, Chandrababu Naidu, Ashwini Vaishnaw, Nara Lokesh
- What
- Ground‑breaking ceremony for a semiconductor packaging unit, the first ISM‑approved OSAT facility in South India
- Where
- Visakhapatnam, Andhra Pradesh, India
- Why
- To boost India’s semiconductor packaging ecosystem, create jobs, and support domestic and export markets
- Project investment
- 2,387.81 crore
- Production capacity
- 96 million chips per year
- Direct jobs
- 1,000+
- Indirect jobs
- 1,600+
- Facility type
- ISM‑approved OSAT
- Location
- Tarluvada Village, Anandapuram Mandal, Visakhapatnam district