Archive · 19 Sep 2026
India Seeks Patient Capital to Build Chip Companies
Making a computer chip takes a long time and costs a lot of money.
A company must pay for design, testing and factory production before it can sell anything.
If the design has a problem, making a new version can cost a lot and take several months.
This is different from software, which can usually be changed more quickly.
Srini Chinamilli of Tessolve says chip startups need investors who will stay involved for years.
Government funding could help companies during their riskiest early stages.
Venture funds, large Indian businesses and global chip companies could provide support as the startups grow.
Shared tools and factories could also lower costs and help successful companies compete globally.
India’s semiconductor ambitions require chip-product companies, not only fabrication plants and large investments.
Tessolve CEO Srini Chinamilli says investors must support startups through design, tape-out, validation and commercial scale.
Chip startups face major early costs for engineering, intellectual property, EDA tools, fabrication, testing and packaging.
The Semicon 2.0 framework offers milestone-linked seed funding, equity co-investment and shared design and validation resources.
Chinamilli advocates a funding mix involving government, specialist investors, industrial groups and global semiconductor companies.
- Who
- Indian chip-product startups, investors and government programs, with views highlighted by Tessolve CEO Srini Chinamilli.
- What
- India is seeking funding and infrastructure to help semiconductor startups develop and commercialize their own chip products.
- When
- The discussion comes as India expands domestic chip-design support; the supplied material identifies the data as of 2026.
- Where
- India, with potential support from global semiconductor companies, equipment makers and foundries.
- Why
- Chip development requires substantial spending long before revenue and can face costly delays from design or manufacturing problems.
- Central funding need
- Patient capital that remains available from initial design and tape-out through validation, productisation and commercial scale.
- Early expenses
- Engineering, intellectual property licences, electronic design automation tools, verification and prototype manufacturing.
- Additional development stages
- Packaging, testing, debugging, silicon validation and reliability assessment.
- Government framework
- Semicon 2.0 provides milestone-linked seed funding, equity co-investment and shared access to design and validation resources.
- Proposed funding sources
- Government support, specialist venture and private-equity investors, large domestic industrial groups and global semiconductor companies.
- Infrastructure needs
- Startups need access to prototyping, fabrication, packaging, testing, validation and productisation capabilities.
- Investment process
- Funding decisions should maintain technical and commercial scrutiny while moving quickly enough to match engineering costs and cash needs.