Archive · 27 May 2025
Samsung to Replace Silicon with Glass for Advanced AI Chips by 2028
Imagine tiny computer chips that are super smart, especially for AI.
Right now, these chips use silicon, which is expensive.
Samsung is working on a new way to build these chips using glass instead of silicon.
Glass is cheaper and can make the chips work better.
They plan to start using this new tech by 2028.
Other companies like TSMC are working on similar ideas.
This could mean faster, more efficient AI chips in the future.
It is like switching from using expensive blocks to build a castle to using less expensive and better blocks.
Samsung is developing glass substrates to replace silicon for AI chips.
The goal is to lower manufacturing costs and improve performance.
Samsung plans to use panel-level packaging at its Cheonan facility.
TSMC is also developing similar technology.
The technology could launch as soon as 2028.
- Who
- Samsung is developing the technology, and TSMC is also working on similar solutions.
- What
- Samsung plans to replace silicon with glass interposers for AI chips.
- When
- Production is expected to begin as soon as 2028.
- Where
- Samsung's Cheonan facility
- Why
- To reduce manufacturing costs and improve performance of AI chips.
- New Material
- Glass interposers
- Expected Launch
- 2028 (Samsung)
- Production Site
- Cheonan facility
- Targeted Technology
- AI chips
- Manufacturing method
- Panel-level packaging (PLP)