Archive · 23 Sep 2025
Microsoft Uses Microfluidics to Cool AI Chips
Imagine computer chips getting really hot, like a stove!
Microsoft is trying a new way to cool them down.
They're using tiny channels to send liquid directly through the chips, which helps keep them cool.
This is especially helpful for AI chips that use a lot of power and get very hot.
This new system is part of Microsoft's plan to make its data centers more efficient.
It also allows for "overclocking", which means they can boost the chip's power when needed, like during meetings.
Plus, they're using new air-based networking cables for faster internet.
Microsoft is testing microfluidics to cool AI chips in data centers.
The cooling method involves circulating fluid directly through chips.
The technology allows for high cooling fluid temperatures up to 70C.
Microsoft is also deploying hollow-core fiber for faster data transmission.
The company is also working on memory chip technology.
- Who
- Microsoft
- What
- Is using microfluidics to cool AI chips.
- When
- Testing the technology now.
- Where
- In Microsoft data centers, starting in Redmond, Washington.
- Why
- To improve efficiency, enable more powerful chips, and handle surges in demand.
- Company
- Microsoft
- Technology
- Microfluidics for chip cooling
- Application
- Cooling AI chips in data centers
- Temperature
- Cooling fluid can reach 70C (158F)
- Additional Tech
- Hollow-core fiber for faster networking