Science & Tech · AI · 4 hrs ago
DEEPX advances AI chip partnerships with Intel and discusses ties with AMD
South Korean AI chipmaker DEEPX is expanding work with Intel to make its processors easier to use with Intel’s AI software.
The company is connecting its neural processing units, or NPUs, to Intel’s OpenVINO system, with early results expected early next year.
DEEPX is also discussing possible cooperation with AMD, but those talks are still at an early stage.
A new DEEPX chip is being prepared using Samsung’s 2-nanometer process, with the first chip expected around March or April next year.
DEEPX says it has completed software integration with Amazon Web Services to send and update AI models on devices, and plans to release software for robots later this year.
The company received 77 purchase orders from more than 10 countries in the year to July, while about 300 companies worldwide are evaluating its chips.
DEEPX has not set an IPO date, but its chief executive said he would like to list within three years.
DEEPX is advancing technical work with Intel to integrate its neural processing unit into Intel’s OpenVINO AI software ecosystem.
DEEPX chief executive Kim Nok-won said the company expects initial results from the Intel work in early 2027.
The company is discussing possible cooperation with AMD and preparing follow-up talks.
DEEPX plans to tape out a chip using Samsung Electronics’ 2-nanometer process in October 2026.
Kim said DEEPX received 77 purchase orders from more than 10 countries in the year to July 2026.
- Who
- DEEPX, an artificial intelligence chip company, and its chief executive, Kim Nok-won.
- What
- DEEPX is working with Intel on integrating its NPU with OpenVINO and discussing possible cooperation with AMD.
- When
- Kim discussed the plans in an interview on October 15, 2026; initial Intel results are expected in early 2027.
- Where
- The interview took place at DEEPX’s office in Seongnam, South Korea.
- Why
- DEEPX aims to expand in the global physical AI market and make its NPU easier to use with Intel systems.
This story does not have two clearly opposing sides.
Kim gave an interview to Yonhap at DEEPX’s office in Seongnam.
DEEPX said it planned to tape out a chip using Samsung Electronics’ 2-nanometer process.
Kim expected initial results from the Intel technical cooperation.
Kim expected the first chip made using Samsung’s 2-nanometer process to be ready.
- Intel software
- OpenVINO
- Expected initial Intel results
- Early 2027
- Next-generation chip process
- Samsung Electronics’ 2 nanometers
- Expected first 2-nanometer chip
- March–April 2027
- Purchase orders
- 77 from more than 10 countries in the year to July 2026
- Companies evaluating DEEPX chips
- About 300 worldwide
What people are saying
The goal is to make it possible to use DEEPX’s NPU immediately by connecting it to an Intel system.
I expect initial results after this winter, around early next year.
Physical AI often operates on batteries or in harsh industrial environments.
If we reduce power consumption, we can extend battery life and lower cooling demands.