Business · Companies · 2 hrs ago
Samsung wins AMD contract for next-generation HBM4 base die
Samsung has won a contract to make AMD’s next-generation HBM4 base die at its second plant in Taylor, Texas.
HBM4 is a type of high-bandwidth memory, and the deal gives Samsung a foothold in a market where SK Hynix has been strong through HBM3E.
The account describes a close SK Hynix-TSMC partnership in earlier generations, and Samsung is now moving into that space.
AMD is the customer, while Samsung will make the base die, a component of the memory.
The deal could strengthen Samsung’s position against SK Hynix in the competition to supply advanced memory.
The details provided do not explain why AMD chose Samsung or say what happens next.
Samsung Electronics won AMD’s contract for the base die in its next-generation HBM4 memory.
The work will take place at Samsung’s Taylor 2 plant in the United States.
The deal gives Samsung a foothold in its effort to catch up with SK hynix, according to Maeil Business.
The article says the contract breaks into a partnership between SK hynix and TSMC that had remained strong through HBM3E.
Maeil Business asked why AMD chose to work with Samsung but did not provide an answer in the text supplied.
- Who
- Samsung Electronics and AMD.
- What
- Samsung won AMD’s contract for the base die in next-generation HBM4 memory.
- When
- Maeil Business published the report on November 4, 2026.
- Where
- Samsung’s Taylor 2 plant in the United States.
- Why
- Not stated.
This story does not have two clearly opposing sides.
This story does not have a timeline yet.
- Contract
- AMD’s next-generation HBM4 base die
- Supplier
- Samsung Electronics
- Manufacturing site
- Taylor 2 plant, United States
- Publication date
- November 4, 2026